Facilities
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Combined Scanning Laser Doppler Vibrometer and White Light Interferometer
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Base unit (GAN621C1) with a 900nm super luminescent laser diode providing over 150 nm of bandwidth
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Capable of 3.0 μm axial resolution, an imaging depth of 1.9 mm in air and a line scan rate up to 248 kHz
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Coupled with a scanning system (OCTG9), and a scan lens kit (OCT-LK2-BB) of 4.0 µm lateral resolution
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Custom-made tribometer to study the friction forces at the interface of fingertip and various substrate
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Utilizes a feedback control loop to keep the normal forces constant during the experiment while maintaining contact angle
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Picosecond 515nm green laser cutter for advanced PCB research and development
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Laser cutting, drilling and controlled depth engraving
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Can be used to cut or ablate materials such as PCBs, Si wafers, glass, metals and polymers such as PDMS, PET, and Polyimide
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COHERENT Chameleon Ultra femtosecond laser with COHERENT Optical Parametric Oscillator (OPO-VIS) wavelength extension
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Two-tint (785nm) detection with modulated probe beam
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Capable of high throughput through-plane and in-plane thermal transport analysis
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Integrated with high precision thermal control stage (-190°C to 400°C) for measuring sample properties at different temperatures
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Custom high voltage environmental capability for nanoscale electroadhesion and electrowetting studies
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Biometric system capable of providing seamless insight into:
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Eye tracking - Tobii Pro Glasses 2
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EEG - ABM B-alert X24 EEG Headset
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ECG and EMG - Biopac MP160
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Facial expression measurement
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High vacuum thin film deposition instrument for FE-SEM imaging and TDTR measurements
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Fully automated two-target process for metals such as Au, Ti, Al, Mo etc.
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Automatic film applicator provides a reliable basis to apply coating films to flexible substrates in a uniform and reproducible way in order to eliminate variations caused by human factors
